MTK MT1 SERIES POWER IC BGA REBALLING STENCIL(0.12MM)
MTK MT1 SERIES POWER IC BGA REBALLING STENCIL
BGA rework stencils are made from a polyimide lm with a high-temperature adhesive protected by a liner for release. It is the same type of material that you used with bar code labels and during the wave soldering process to secure the gold fingers. A thin sheet of board, plastic, or metal with a pattern or letters cut out of it, used on the surface below to make the cut template.
MTK MT1 SERIES POWER IC BGA REBALLING STENCIL

SKU: GP101
Categories: BGA Stencils, MediaTek
Tags: mt1 series power ic bga, mtk mt1 series power, mtk mt1 series power ic, power ic bga reballing stencil, series power ic bga reballing
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