MTK MT1 SERIES POWER IC BGA REBALLING STENCIL

BGA rework stencils are made from a polyimide lm with a high-temperature adhesive protected by a liner for release. It is the same type of material that you used with bar code labels and during the wave soldering process to secure the gold fingers. A thin sheet of board, plastic, or metal with a pattern or letters cut out of it, used on the surface below to make the cut template.

MTK MT1 SERIES POWER IC BGA REBALLING STENCIL